CBA – CMOS directly Bonded to Array. In this NAND technology each CMOS control wafer and cell array wafer are manufactured separately and then bonded together to deliver, Kioxia says, enhanced bit density and fast NAND I/O speed. It is an alternative to monolithic NAND fabrication in which the control logic and NAND cell array are fabricated on the same CMOS wafer. See CMOS entry.