TSV – Through Silicon Via – a hole etched through a semiconductor wafer or die which is used to form a vertical electrical connection. This avoids fabricating wires to convey currents between the different levels in a wafer or die.
TSV
TSV – Through Silicon Via – a hole etched through a semiconductor wafer or die which is used to form a vertical electrical connection. This avoids fabricating wires to convey currents between the different levels in a wafer or die.
