News

posted on 19 May 2008 14:41

LSI and its Agre Systems subsidiary have complained to the International Trade Commission (ITC) that 18 semiconductor firms are violating its patents concerning tungsten wire connection material use.

The ITC has opened an investigation into activities by the US, Taiwanese, Swiss, Dutch, Chinese and Japanese firms involved: Cypress Semiconductor; Freescale Semiconductor; Integrated Device Technology; Microchip Technology; National Semiconductor; ON Semiconductor; Spansion; AMIC Technology; Nanya Technology; Powerchip Semiconductor; ProMOS Technologies; United Microelectronics; Vanguard International Semiconductor; Micronas Semiconductor Holding AG; STMicroelectronics; NXP BV; Grace Semiconductor Manufacturing; and Elpida Memory.

LSI wants the firms to stop bring bringing products that violate its IP into the US and to stop using its IP.

Tungsten is a component of materials used to connect wires in certain DRAM chips.

^{[Paul Roberts, news editor.]}